TMA combined temperature controller application in hot plate furnace temperature control

Background Introduction

Hot plate furnaces are key equipment in semiconductor manufacturing used for pre-treatment baking of materials such as silicon wafers, gallium arsenide, and glass panels before adhesive coating. Their core function is to simultaneously and efficiently heat multiple semiconductor wafers through a heating mechanism.

01 Solution Introduction

High-Precision, Scalable Temperature Control System

The TMA modular temperature controller provides multi-channel temperature acquisition and heating control, which can be flexibly combined according to the temperature control requirements of different areas of the hot plate furnace to form a high-precision, scalable temperature control system.

02 Solution Topology Diagram

TMB Temperature Controller Main Unit + TEB Output Module + TEC Input Module

32-channel temperature acquisition (thermocouple, PT100, etc.)

32-channel heating control output (SSR/relay drive)

PID intelligent algorithm for precise temperature control

Supports industrial communication protocols such as RS485 and TCP/IP

Modular expansion for flexible adaptation to different hot plate sizes and heating areas

Combined temperature controller

Modular design, flexible configuration, meets diverse temperature control needs

A wide range of product models are available, with up to 64 outputs and 192 inputs expandable.

03 Solution Value

• High-Precision Temperature Control: The TMA combined temperature controller employs an intelligent PID algorithm and multi-channel independent control, achieving high-precision temperature control of ±0.1℃. This ensures uniform temperature across different areas of the hot plate furnace, effectively improving process consistency and product yield.

• Flexible and Scalable: The modular design allows for the free expansion of temperature control modules based on the heating area of ​​the hot plate furnace. Each module can independently acquire temperature and control heating output. It can quickly adapt to any size of the hot plate furnace or the complexity of the process.

• Intelligent Monitoring and Safety: It promptly detects abnormal temperature fluctuations and automatically protects the equipment. This effectively prevents overheating or thermal runaway, ensuring production safety while reducing manual inspection costs and improving operational convenience.

Other application scenarios