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How to Choose High-Temperature EtherCAT I/O Modules? An Analysis of High-Temperature Aging Tests for 90°C Card-Style I/O Modules
Update Time:2026-09-19 14:43:31
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Why are high-temperature-resistant EtherCAT I/O modules required for high-temperature environments?
• Industrial equipment often has limited internal space, subjecting electronic modules to prolonged high-temperature conditions.
• Environments such as control cabinets, equipment chambers, ovens, and burn-in testing systems operate at elevated temperatures.
• Standard I/O modules may experience issues like communication errors, signal drift, or abnormal response times in high-temperature environments.
• EtherCAT networks demand high levels of real-time performance and stability.
• Therefore, beyond basic I/O functionality, it is essential to verify the module's ability to operate reliably over the long term in high-temperature conditions.
90°C High-Temperature-Resistant EtherCAT Card-Style I/O Module

The EtherCAT slice I/O module features a modular design. The EtherCAT adapter supports the connection of up to 32 I/O modules, enabling real-time data communication via the EtherCAT bus. It provides users with high-speed data output and acquisition capabilities, optimizes system configuration, simplifies field wiring, and enhances overall system reliability.
The EtherCAT adapter supports a wide range of expansion modules, including digital input, digital output, analog input, and analog output modules, meeting the needs of industrial automation control applications across various sectors.
Product Composition
The EtherCAT slice I/O system consists of an EtherCAT adapter and various modules, including digital input (DI), digital output (DO), analog input (AI), and analog output (AO) modules. A single adapter supports the connection of up to 32 expansion modules in flexible configurations.
| Ordernumber | Class | Name | Model | Explain |
|---|---|---|---|---|
| 1 | Adapter | AdapterModule | GME2032 | EtherCATadapter–supportsupto32expans-ionmodules |
| 2 | DImodule | DIExpansionModule | GEA1016 | 16LUDIExpansionModule–NPNInput |
| 3 | GEA2016 | 16LUDIExpansionModule–PNPInput | ||
| 4 | DOmodule | DOExtensionModule | GEB1016 | 16LUDOExpansionModule–NPNOutput |
| 5 | GEB2016 | 16LUDOExpansionModule,PNPOutput | ||
| 6 | AImodule | AIExtensionModule | GEC2004 | 4LuAIExpansionModule–0–10VInput |
| 7 | GEC2008 | 8LuAIExpansionModule–0–10VInput | ||
| 8 | GEC5004 | 4LuAIExpansionModule–4–20mAInput | ||
| 9 | GEC5008 | 8LuAIExpansionModule–4–20mAInput | ||
| 10 | AOmodule | GEU2004 | 4LuAOExpansionModule–0–10VOutput | |
| 11 | AOExpansionModule | GEU2008 | 8LuAOExpansionModule–0–10VOutput | |
| 12 | GEU5004 | 4LuAOExpansionModule–4–20mAOutput | ||
| 13 | GEU5008 | 8LuAOExpansionModule–4–20mAOutput |
High-Temperature Burn-in Test for EtherCAT Card-type I/O Modules
| Productname | Productmodel | Quantity | ||
| GuangzhouRongshuoEle-ctronicTechn-ologyCo.,Ltd. | AdapterModule | GME2032 | 2individual | |
| DIExpansionModule | GEA2016 | 2individual | ||
| DOExtensionModule | GEB2016 | 2individual | ||
| AIExpansionModule | GEC5008 | 2individual | ||
| AOExpansionModule | GEU5008 | 2individual | ||
| TCExtensionModule | GEC8008 | 1individual | ||
| Testitem | High-temperatureagingtest | TestDate | September13,2026 | |
| 1、TestHardwareTopologyDiagram | ||||
![]() | ||||
2、 Test Prerequisites:
2.1 One set of GME2032, GEB2016, GEA2016, GEU5008, and GEC5008 modules each for the oven
interior and exterior.
2.2 The oven's discrete and analog input/output modules are connected to the oven's external discrete and
analog output/input modules, respectively.
2.3 The product inside the test oven shall operate normally under an environmental temperature of 90.C;
the equipment shall be simulated operating under high-temperature conditions, with a test cycle of
72 hours.
3、 Test Purpose:
3.1 For products tested in the oven: the packet loss rate for the GEA2016 and GEB2016 input/output
modules is 0%; the accuracy of the GEA5008 and GEC5008 input/output modules is ≤1%, and the
accuracy of the temperature input module is ≤1°C.
3.2 The product inside the oven is communicating normally with the PLC.
4、 Requirement:
4.1 If the specified product functions or performance characteristics during testing meet the expected
results, the product is considered合格 (qualified).
4.2 If any single or multiple functions fail to achieve the expected results during the testing process, the
product shall be deemed non-compliant
5、 Test Environment and Tools:
5.1 The entire test was conducted as a simulated test in the company's debugging room.
5.2 Primary testing equipment: High-Temperature and Low-Temperature Test Chamber, Omron NX1P2,
Kunlun Touch Screen.
6、 Test Content and Procedures:
6.1 Test the packet loss rate of the EtherCAT card-based discrete I/O modules GEA2016 and GEB2016.
Step 1: The PLC triggers each of the 16 channels of the GEB2016 module (located inside and
outside the oven) once every 30 ms; the actual number of output events is recorded.
Step 2: Record the measured input frequency counts for the 16 channels of the GEA2016 module,
both on the exterior and interior side of the oven.
Step 3: A difference of 0 between the GEB2016 output count and the GEA2016 input count within
and outside the oven is considered normal.
6.2 The measurement accuracy of the EtherCAT card-based analog input/output modules GEC5008 and
GEU5008 is ≤1%.
Step 1: The PLC sequentially outputs 5 mA, 10 mA, and 20 mA to each of the 8 channels of
the GEU5008 module (both inside and outside the oven) every 3 seconds; this sequence
should be repeated continuously.
Step 2: The difference between the external and internal values of the GEU5008 module and
the GEC5008 module represents the error value; record the maximum and minimum error
values for 5 mA, 10 mA, and 20 mA.
Step 3: An error rate of ≤1% is considered normal.
6.3 EtherCAT card-based temperature input – GEC8008; measurement accuracy ≤1°C.
Step 1: The PLC collects the temperature value from the GEC8008 module once every 1 second.
Step 2: A difference between the GEC8008 module temperature reading and the oven setpoint of ≤1
°C is considered normal.
| Testresults:(BasedonChannel1data;analogvaluesaredefinedbythe20mAinputandoutput;errorrate=error/20mA) | ||||||
| Number | Testitem | Expectedresult | Measuredresults | Judge | ||
| A | GEB2016OutputPacketLossRate | Packetlossrate:0% | 0% | passthrough | □notgo | |
| B | GEA2016InputPacketLossRate | Packetlossrate:0% | 0% | passthrough | □notgo | |
| C | GEU5008–20mAoutputerrorrate | Errorrate≤1% | 0.7% | passthrough | □notgo | |
| D | GEC5008–20mAInputErrorRate | Errorrate≤1% | 0.2% | passthrough | □notgo | |
| E | GEC8008Input:90.CError | Error≤1.C | 90.8°C | passthrough | □notgo | |
| F | GME2032CommunicationFault | Failurerate:0% | 0% | passthrough | □notgo | |
| TestEnvironmentDiagram: | ||||||
![]() ![]() A. The difference between the GEB2016 output count inside the oven and the GEA2016 input count outsidethe oven (16 channels) ![]() B. The difference between the GEB2016 output count and the GEA2016 input count inside the oven (16channels). ![]() C. Maximum/Minimum error between the GEU5008 output inside the oven and the GEC5008 inputoutside the oven (8 channels) ![]() D. Maximum/Minimum error between the GEU5008 output (external to the oven) and the GEC5008input (internal to the oven) (8 channels). ![]() E. Temperature deviation between the measured temperature and the set temperature for the GEC8008sensor within the oven (8 channels) ![]() F. Communication record between GME2032 and PLC within the oven. ![]() 7、 Test Result Determination:Test result data evaluation: The high-temperature aging test for the EtherCAT card-based IO moduleyielded results consistent with expectations; the test has been passed! | ||||||
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